TSMC
TSMC Moves Into Embedded Memory and 3D DRAM as AI Bottlenecks Shift
TSMC is advancing embedded memory and assessing 3D DRAM for Nvidia, signaling that AI constraints now extend beyond compute.
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SK Hynix
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Pat Gelsinger
Former Intel CEO Calls HBM 'Lousy' — AI Chip Cost Structure May Shift
Former Intel CEO Pat Gelsinger and an SK Hynix VP both question HBM as AI memory's best answer. HBM is nearly half of AI chip costs — this matters.